Summary of "Embedded Systems and Design & Development - Feb 16, 2026 | Morning | VisionAstraa EV Academy"

Embedded Systems & EV Design — VisionAstraa EV Academy

Session: Feb 16, 2026 (morning)

High-level focus

This course section covered automotive embedded architecture as it applies to electric vehicles (EVs): how controllers, software stacks, power electronics and domain/zonal architectures connect to form modern EV systems.

Software / embedded stack (what to learn)

MCU as the basic control element — program MCUs to enable vehicle functions.
AUTOSAR-like Basic Software (BSW) layers:
- Service layer
- ECU Abstraction layer
- Microcontroller Abstraction layer
Complex Device Drivers (CDD) sit between the AUTOSAR Runtime Environment (RTE) and hardware to invoke lower-level functions.
Real-time call flow: application layer → RTE → CDD → hardware/ECU.
Evolution of compute:
- Hobby/legacy MCUs (Arduino, 8051)
- Industry ECUs
- High-performance multi-core SoCs (ARM Cortex multi-core, GPUs, DSPs) used in domain controllers / centralized compute

Vehicle hardware & powertrain

Main EV components:
- Battery (DC chemical energy) and Battery Management System (BMS)
- Traction inverter and motor
- Power Distribution Unit (PDU)
- Motor controller / Vehicle Control Unit
- Onboard charger (OBC)
- Auxiliary power (e.g., buck converters: 48V → 12V)
Key EV differences vs ICE vehicles:
- Far fewer moving parts
- No multi-gear dependency; throttle maps directly to motor torque/speed
Energy losses that affect efficiency and range:
- I^2R (resistive) losses
- Eddy current losses
- Transmission losses

Power electronics, charging and converters (technical points)

OBC / charging chain overview:
- AC grid → PFC/rectifier → DC link → DC‑DC or inverter → battery charging
- Bidirectional capability noted (V2G, V2L)
Converter topologies mentioned:
- Bridgeless totem‑pole PFC (high efficiency, uses MOSFETs)
- Buck / boost DC‑DC converters for step‑down / step‑up
- Dual Active Bridge (DAB) for bidirectional DC‑DC
- Inverter for DC→AC to drive AC motors
Semiconductors:
- Emphasis on wide‑bandgap devices (SiC MOSFETs, GaN)
- Benefits: higher efficiency at high voltage (e.g., ~800 V) and switching frequency
- Design demands: gate drive, layout, thermal management
Practical circuit topics:
- Rectification and active rectification / ideal diodes (lower loss than standard diodes)
- Use of MOSFETs to reduce conduction and switching losses

Design challenges & practical solutions

Paralleling SiC MOSFETs:
- Current imbalances due to Vth differences
- Mitigations: precise binning, Kelvin source connections, careful gate loop decoupling
Gate driver and protection:
- Manage spikes (active clamping), reliable gate driving, negative bias and detection strategies, gate‑drive isolation
Signal integrity and isolation:
- Use level shifters and digital isolators between low‑voltage MCU (e.g., 3.3 V) and high‑side gate drivers
Low‑voltage efficiency:
- Use active rectification / ideal diode techniques to avoid diode losses
Thermal and packaging:
- Copper‑clip / LF pack / CFP instead of wire‑bond for superior thermal dissipation and lower resistance
Simulation recommendation:
- Model and test DAB and converter topologies in MATLAB/Simulink

Architecture trends and connectivity

Evolution of ECU architecture:
- Historically many distributed ECUs and heavy wiring
- Domain controllers (2000s–2010s) as a nervous-system approach
- Centralized/zonal architectures post‑2020 for further consolidation
Zonal architecture advantages:
- Significant weight reduction (up to ~50% reduction in copper cabling)
- Localized power distribution and simplified harnessing
- Easier manufacturing automation and better fault containment
In-vehicle communications:
- CAN, CAN‑FD (higher data rates), FlexRay
- Gigabit Ethernet for high throughput and centralized compute
Safety & security:
- ISO 26262 (functional safety)
- ISO 21434 (automotive cybersecurity)
- Hardware security: encrypted boards, secure key storage
Power management:
- PMICs supply low rails (e.g., 0.8–5 V) for SoC and peripherals
- PMIC controllers manage sequencing and power domains

Takeaway summary

Embedded software (AUTOSAR/BSW/RTE) and power electronics are tightly interdependent and together shape EV function and efficiency.
Future EVs rely on high‑performance SoCs, robust PMICs, safe and secure hardware design, and modern communication/zonal architectures.
Practical design focus areas:
- Handling SiC/GaN devices
- Gate driver design and protection
- Thermal packaging and advanced interconnects
- Active rectification / ideal diodes
- Bidirectional power flow (V2G/V2L)
- Converter simulation (MATLAB/Simulink)

Suggested study / tutorial items

AUTOSAR basics: BSW layers, CDD, RTE
Power electronics topologies: bridgeless totem‑pole PFC, DAB, buck/boost, inverters
SiC MOSFET paralleling techniques and gate‑driver design
Active rectification and ideal diode implementation
MATLAB/Simulink modeling of converter circuits
ISO 26262 and ISO 21434 standards
PMIC design and SoC power sequencing

Main speakers / sources referenced

Instructor: Bajira (primary presenter)
Other referenced / earlier instructors: Punar, Punit, Puniter (battery, motor, EV architecture topics)
Supporting staff / to join later: Yusur and Nikil (Nikil sir)